AiXun UP200 Industrial High-Activity Nano-Rheology No-Clean Flux Paste (10cc Syringe)
AiXun UP200 Nano-Rheology Flux Paste
High-activation surface tension reduction gel for micro-electronics rework. Engineered with a specialized zero-halogen organic matrix to ensure uniform intermetallic compound (IMC) boundary layer formation during lead-free alloy thermal phases.
Advanced Wetting Mechanics & Activation
The chemical compound uses a high-purity vehicle designed to trigger oxide-reduction pathways across an active 120°C to 180°C pre-heating window. By rapidly deoxidizing micro-pads and alloy sphere terminals, the paste improves the capillary draw of liquid alloys. This enhanced fluid movement ensures symmetric sphere deposition during BGA reballing. It prevents standard defects like bridge shorts, void grouping, and incomplete cold joint connections on dense, modern logic board surfaces.
Viscoelastic Slump Control & SIR Metrics
Formulated for precise syringe needle application, the material demonstrates exceptional structural viscosity stability under continuous heat load. This rheological control limits lateral paste slump or bleeding when exposed to localized hot-air or IR pre-heating profiles, keeping the activation compounds isolated entirely to the target area. The post-reflow carrier sets into a crystalline, transparent, non-conductive layer that fulfills rigorous Surface Insulation Resistance (SIR) criteria without requiring secondary cleaning processes.
Facility First-Pass Yield Optimization & Environmental Safety
Integrating standard consumable chemistries like the zero-halogen AiXun UP200 ensures absolute processing compliance with international RoHS and IPC electronics standards. The low-smoke, low-degassing formulation minimizes volatile organic compound (VOC) emissions, protecting technical staff inside high-volume repair spaces. Additionally, its non-corrosive residue prevents circuit traces from degrading due to humidity in the field, helping to secure long-term hardware reliability metrics.
Chemical & Operational Material Parameters
| Engineering Parameter | Specification Value / Standard Compliance |
|---|---|
| Flux Classification Code | ROL0 / Halide-Free, No-Clean High-Activity Core |
| Dispensing Volumetric Unit | 10cc Standard Luer-Lock Fluid Cylinder Syringe |
| Activation Temperature Window | 120°C - 180°C (Active Interfacial Oxide Reduction) |
| Viscosity Maintenance Target | Anti-Slump Structural Thixotropic Matrix under hot-air convection |
| Alloy Matrix Compatibility | SAC305, Sn63/Pb37, Sn-Bi-Ag, and generic Lead-Free industrial profiles |
| Post-Reflow Residue Profile | Crystalline Translucent, Non-Conductive, Hydrophobic Polymeric Shell |
| Corrosivity Threshold | Non-Corrosive (Passes IPC-TM-650 Copper Mirror & Chromate Paper standards) |
Laboratory Deployment Mapping:
- High-Density BGA Chip Planting: Formulated with a balanced tack profile to hold micro-solder balls securely within stencils, preventing alignment shift before the reflow process.
- Level-3 Smartphone Motherboard Rework: Optimized to protect copper tracks during desoldering or re-soldering of multi-layered Basebands, Power Management ICs, and high-tier SoC chip stacks.
- Fine-Pitch SMT Component Sorting: Suitable for manual or semi-automated paste placement via fine-gauge nozzle kits on micro-components like 0201 and 01005 passives.
B2B Fulfillment & Compliance Standards: AMDETECH is an authorized commercial supplier of genuine industrial AiXun micro-soldering consumables. Every batch is hermetically sealed and climate-controlled to preserve viscosity and expiration profiles. For tax-free EU cross-border wholesale logistics, ensure your company's corporate VAT identification parameters are validated active inside your member account settings before checking out.
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