AiXun H310D Networked Thermodynamic Workcell
Network-integrated thermal extraction station for advanced integrated circuit rework. Engineered with a 1000W high-flux heating element and localized telemetry synchronization to standardize complex micro-BGA extraction processes across high-density substrates.
Networked Telemetry & Cloud Profile Sync
The H310D transitions component desoldering into a data-driven process through its pre-integrated WiFi and Bluetooth IoT module. Engineering supervisors can connect the station directly to cloud databases to download, program, and run segmented thermal profiles. This automated control over pre-heating, soaking, reflow, and cooling stages completely removes manual operator exposure errors. The station supports real-time remote calibration data logging and OTA firmware tracking, maintaining tool alignment with global facility quality standards.
1000W High-Flux Output & Fluid Dynamics
Equipped with a heavy-duty 1000W ceramic heating core, the thermal engine handles rapid heat ramping while maintaining uniform air temperature dispersion. Regulated by a closed-loop PID air-and-heat calculation system, the station manages a linear airflow column through precision internal fan blowers. This controlled fluid delivery provides absolute thermal uniformity across large ground plane masses and underfilled IC chips, preventing localized board warping and track damage during multi-layer chip desoldering.
Facility Rework Repeatability & Hardware Insurance Metrics
Manual hot-air rework operations traditionally introduce high failure rates due to inconsistent hand-speed and thermal overshoot. Standardizing technical facility benches with the network-controlled AiXun H310D allows supervisors to deploy encrypted, unalterable heating recipes across multiple active workcells. This data-driven limitation reduces accidental trace lifting, protects delicate adjacent chips, and minimizes insurance liability parameters for premium client hardware assemblies.
Station Parameters & Specifications
| Engineering Parameter | Specification Value / Standard |
|---|---|
| Peak Thermal Capacity | 1000W Maximum Continuous Output Performance |
| Network Interconnect Profile | Integrated Dual-Band WiFi & Bluetooth IoT Telemetry Matrix |
| Operational Temperature Scope | 100°C - 500°C (Real-Time Closed-Loop Monitored) |
| Airflow Volume Velocity | 1 - 100% Linear Scale Regulation Curve |
| Display Diagnostics Module | High-Definition Segmented IPS Screen with Real-Time Curve Metrics |
| Safety Isolation Loop | Automatic Magnetic Induction Standby Cradle with Soft-Cooling Phase |
| Chassis Safety Shielding | ESD-Safe Grounded Enclosure with Isolated Leakage Defense |
Laboratory Deployment Mapping:
- Level-3 Apple Motherboard Refurbishment: Programmed to deliver uniform thermal soak zones across dense, multi-layered layered iPhone structures, executing clean CPU, baseband, and NAND desoldering sequences.
- Underfilled IC Package Extraction: Provides highly linear airflow control to safely melt perimeter adhesives and resin compounds without disturbing surrounding surface-mount components.
- Continuous Component Desoldering: Built with a durable air pump handle assembly that remains cool during continuous use, keeping team operations efficient during long shifts.
B2B Fulfillment & Compliance Standards: AMDETECH is an authorized commercial supplier of genuine industrial AiXun smart welding modules. Every station undergoes digital thermostatic calibration to confirm exact factory parameters before shipment. For tax-free EU cross-border wholesale logistics, ensure your company's corporate VAT identification parameters are validated active inside your member account settings before checking out.
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